Author : Neha Jain, Dinesh Arora and Sandeep Kumar

This paper reports the effect of residual stress of different materials on displacement of the actuator. This study has been done by designing and simulating the microactuator using COMSOL Multiphysics 4.2a. The behaviour of the microactuator is studied for different materials like polysilicon, gold, nickel, copper and argentum at an applied potential difference of 4V between the contact pads.

Keywords: MEMS, Actuators, Electrothermal, Chevron, Residual Stress.

Article published in International Journal of Current  Engineering  and Technology, Vol.3,No.1 (March- 2013)