A Comparative Delay Analysis of Copper Interconnect with Future Candidate CNT
Pages : 606-610
Development in VLSI technology leads to various futuristic possibilities as well as various design challenges for ICs. With a pace of time technology of copper interconnect suffers from various problems such as power dissipation, delay, cross talk etc. In order to meet the demand of futuristic technology of interconnects a promising alternative solution comes out to be carbon nanotube (CNT). In this paper a comparative analysis is made to investigate the problems of interconnect that are facing by current technology i.e. copper interconnect and to identify its alternative solution scope for the interconnect problem by comparative analysis. In this paper traditional copper interconnects are compared to new innovative interconnect that is made by bundles of single wall carbon nanotubes. The delay the performance of the CNT –bundle and copper interconnects was compared respectively at local, intermediate and global lengths.
Keywords: Interconnect, Copper (Cu), Carbon Nanotube (CNT), Single wall Carbon Nanotube (SWCNT),Multi wall Carbon nanotube(MWCNT),Resistance Capacitance(RC)
Article published in International Journal of Current Engineering and Technology, Vol.3,No.2 (June- 2013)