Article Published In Vol.4,No.2(June-2014)

  • Cooling System of Electronic Devices using Microchannel Heat Sink
  • Author  :  Shekhar D. Thakre, V. B. Swami and Prateek D. Malwe
  • Pages   :  58-60
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  • Abstract

Increase in working speed of micro or macro electronic devices requires manufacturing of microprocessor with large number of transistors. It causes increase in heat generation. Thus thermal issues are the key elements which limit the processor’s maximum performance. It is the major obstacle in the development of advanced electronic products. If no precaution is taken to develop more effective and innovative cooling methods, temperature rise will cause reduction in mean- time to failure and performance degradation. One promising solution to the problem is liquid cooling incorporating microchannel heat sink. Hence, it is necessary to have efficient cooling systems of micro or macro electronic devices.

Keywords: Microchannel heat sink, Transistors, Thermal issues, Aspect ratio, Heat transfer coefficient

Article published in International Journal of Thermal Technologies, Vol.4, No.2 (June- 2014)