An Experimental Study on Heat Transfer Enhancement of Flat Plates using Dimples
Pages : 283-288, DOI:http://Dx.Doi.Org/10.14741/Ijcet/22774106/spl.5.6.2016.54
Dimples play significant role in heat transfer enhancement of electronic components cooling systems. Heat transfer describes the exchange of thermodynamic energy, between actual systems depending on the temperature and pressure, by dissipating heat. The basic modes of heat transfer are conduction or diffusion, convection and radiation. Heat flow always occurs from a region of high temperature to another region of lower temperature. Heat transfer changes the internal energy of the given systems involved according to the First Law of Thermodynamics. In case of natural convection is a mechanism, or type of heat flow, in which the fluid flow is not generated by any external source (like a suction device, fan, pump, etc.) but only by density differences in the fluid occurring due to temperature variation. In natural convection, fluid surrounding a heat source absorbs heat, becomes less dense and rises. The surrounding, cooler fluid then moves to replace it. The performance of the system was carried out for Natural convection conditions with air as a working fluid. The overall heat transfer coefficient and Nusselt numbers at different sizes of dimples were obtained. From the obtained results, it was observed that the heat transfer coefficient and Nusselt numbers increases with increase in heat input to the system.
Keywords: Electronic Cooling, Natural Convection, Dimples, Passive Techniques